DigiTimes reports TSMC is getting ready to start mass production of 28nm chips in 2011. The 28nm capacity is expected to be fully utilized by the end of 2011.

TSMC has made significant progress in upward adjusting the manufacturing readiness of 28nm equipment at its Fab 12 in the Hsinchu Science Park HSP), with the maturity level hiked from less than 50% in the fourth quarter of 2009 to more than 90% currently, the company indicated. The more advanced the manufacturing processes, the lower the initial manufacturing readiness of equipment and more efforts needed for adjustments, TSMC said, adding 90nm equipment, for example, has an initial maturity level of nearly 100% and almost does not need any adjustment, TSMC explained.