Thermaltake Technology, a global leader and innovator in the PC DIY market, and CoolChip Technologies, the pioneer and worldwide leader in Kinetic CoolingM, today announced a partnership to introduce the Engine 27 1U Low-Profile CPU Cooler.

Thermaltake’s Engine 27 is the first in the Engine X series of low-profile CPU coolers with the latest air cooling technology for small form factor applications. The Engine 27 1U Low-Profile CPU Cooler offers an excellent balance between performance, size and acoustics with the low-profile design. The Engine X series aims to make available products that unlock increasingly superior performance.
  

 
“We at Thermaltake always believe that behind a good brand is a great product, and the better the product the better the brand. This is also the reason why we set our brand mission as delivering the perfect user experience. We believe CoolChip’s innovative technology is revolutionary and will enable us to continue to deliver the best products for our users. Although now we mainly focus on developing new liquid-cooling products, air coolers still play an important role in our product portfolio. Particularly, we applied Kinetic Cooling to develop the Engine 27 1U Low-Profile CPU Cooler regardless of the compact fan design or the unique aluminum alloy made structure. We took every detail seriously to produce the best low-profile CPU cooler, eventually achieve our mission”, announced Kenny Lin, Thermaltake CEO and Chairman.

Will Sanchez, CEO of CoolChip Technologies expressed, “We are excited to join forces with Thermaltake for the retail market, and to work with their experienced team in launching the Engine X series products. Thermaltake’s values, pursuit of excellence through innovation, and insights into technology-enabled solutions align perfectly with CoolChip. Their global brand, reputation for quality, and customer service is a testament to the commitment to enabling the future in PC DIY systems. Our partnership with Thermaltake is the first step in rendering the traditional heat-sink plus-fan approach obsolete and ushering the next generation of air cooling solutions.”