Samsung introduced a groundbreaking achievement: the world's first 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. Building on the commencement of mass production for 12 nm-class 16Gb DDR5 DRAM in May 2023.
SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics, emphasized, "Our 12 nm-class 32Gb DRAM positions us to provide DRAM modules of up to 1-terabyte (TB), aligning perfectly with the burgeoning demand for high-capacity DRAM in the AI (Artificial Intelligence) and big data era. We will persist in advancing DRAM solutions through unique process and design technologies to redefine the limits of memory technology."
Samsung's trajectory of success in memory technology began with its initial 64-kilobit (Kb) DRAM in 1983, marking a remarkable journey culminating in a 500,000-fold surge in DRAM capacity over four decades. Through the integration of cutting-edge processes and technologies that enhance integration density and design optimization, Samsung's latest memory offering presents the highest capacity for a single DRAM chip within the industry. This innovation provides double the capacity of 16Gb DDR5 DRAM in the same package dimensions.
In contrast to prior requirements for Through Silicon Via (TSV) processes in the manufacturing of DDR5 128 GB DRAM modules with 16Gb DRAM, Samsung's 32Gb DRAM obviates the need for the TSV process. Additionally, it exhibits approximately 10% lower power consumption when compared to 128 GB modules equipped with 16Gb DRAM. This groundbreaking feat makes the product an optimal solution for power-efficient-focused enterprises like data centers. With the introduction of the 12 nm-class 32Gb DDR5 DRAM, Samsung is poised to extend its array of high-capacity DRAM to align with current and forthcoming requirements in the computing and IT sector. The company will underscore its dominance in the next-generation DRAM market by supplying the 12-nm-class 32Gb DRAM to data centers and customers necessitating applications such as AI and cutting-edge computing. The product is also positioned to play a pivotal role in Samsung's continued partnerships with key industry players.
Scheduled for commencement by year-end, the mass production of the new 12 nm-class 32Gb DDR5 DRAM promises to deliver a new horizon of high-capacity memory solutions.
