Samsung announced today that it is now mass producing the industry's first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

"With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, Senior Vice President of Memory Marketing, Samsung Electronics. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."

In the future, Samsung anticipates that UFS will support high-end mobile market needs, while eMMC solutions remain viable for the mid-market, value segments.

For random writing of data to storage, the blazingly fast UFS embedded memory operates at 14,000 IOPS and is 28 times as fast as a conventional external memory card, making it capable of supporting seamless Ultra HD video playback and smooth multitasking functions at the same time, enabling a much improved mobile experience.

Samsung's new UFS embedded memory comes in 128GB, 64GB and 32GB versions, which are twice the capacity of its eMMC line-up, making it today's optimal memory storage solution for high-end mobile devices.

In an attempt to provide more design flexibility to global customers, Samsung's UFS embedded memory package, a new ePoP (embedded package on package) solution, can be stacked directly on top of a logic chip, taking approximately 50 percent less space.

Over the next several years, Samsung will continue to set the pace for memory solutions that combine truly high-performance with high capacity.