And the special thing here is that is is a BGA chip, as in Ball Grid Array. Intel is to fab an SSD BGA-mounted 1TB Intel SSD.

As the info reveals, the new package is actually larger than the NAND on an Intel 600p SSD. The BGA "solder ball" layout also identifies the package as an MCP SSD (multi-chip package). 

If you look at the above photo, to the left you can see a Intel 600p SSD, and in-between the two fingers, that 1TB BGA SSD. 

A single BGA package could be soldered directly onto say a standard M.2 PCB, however, the nature of BGA designs is that they often end up being mounted directly towards a motherboard PCB for a PC or (most likely) laptop. 

It's pretty safe to assume that Intel will be using new 64-layer Micron NAND. Samsung earlier this month also announced their BGA 512 GB eUFS SSD, that model will be applied in smartphones.

Intel Silently Shows Unannounced 1TB BGA SSD