The fourth generation Hygon processor from Sugon, revealed by hardware leaker YuuKi_AnS, uses AMD's SP5 packaging. This is a key feature of AMD's newest Zen 4 processors, suggesting Sugon might be integrating cutting-edge features like DDR5 memory support. However, the full details of the technology used are still being analyzed. The Hygon C86-7490 processor, which is for sale on a Chinese online auction site, shows slight wear and tear. The packaging is labeled 'Designed in Chengdu' and 'Made in China,' following the design patterns of previous Hygon CPUs. These processors use silicon dies made by GlobalFoundries in the U.S., but they have been adapted for the Chinese market with specific encryption capabilities that AMD does not offer. These are then assembled in China, branding them as locally produced.

Despite being in AMD’s newest SP5 packaging, which is normally for high-end server processors, it doesn’t confirm that the latest Zen 4 or Zen 5 AMD chiplets are inside the Hygon processor. A Chinese server manufacturer currently offers systems using the Hygon C86-4G processors with configurations up to 48 DDR5 memory slots, which is compatible with AMD’s EPYC CPUs in SP5 packaging. This setup implies that Sugon may have modified older Zen chiplets to function with AMD's latest input/output dies that include DDR5 memory controllers. Although U.S. sanctions limit advanced processors from being sold to China, these do not extend to certain other advanced components. However, matching older 14nm Zen chiplets with a 6nm IOD intended for newer Zen CPUs is technically challenging due to different voltage needs.

The U.S. has set limits on the performance of semiconductors shipped to China. AMD is able to adjust its chiplets to meet these regulations, allowing Sugon to assemble the CPUs in China without breaking export laws. While the exact makeup of Sugon’s Hygon 4G processors is not fully known, it is clear that they utilize some of AMD’s sophisticated technologies.

Source: tomshardware, YuuKi_AnS