Cooler Master, an industry leading chassis, thermal solution, peripheral, and accessory manufacturer, signals the rebirth of two household names in computing, the Hyper 212 EVO and Hyper TX3 EVO CPU Coolers. They come packed with an improved tower fin design, heat pipe layout, upgraded fans, and fan brackets. All of which provides an even more extreme value for end-users of all types.
Improved Cooling Design
The Hyper 212 & TX3 EVO cooling systems are designed and optimized to provide the best user experience and cooling potential for a new generation of processors. The Hyper 212 EVO now features four Cooler Master patented Continuous Direct Contact (CDC) heat pipes that are tightly packed into a flat array on the CPU Cooler base. This acts as a virtual vapor chamber that dissipates a large amount of heat. The aluminum fin structure has been optimized to provide the perfect performance balance between high and low speed fan operations.
Optimized for current and future generation sockets, the Hyper TX3 EVO sees improvement in its Direct Contact heat pipe performance, expanded socket support, and a higher quality 92mm wide-range PWM fan.
Simple Installation / Dual Fan Design
A high performance PWM fan with anti-vibration rubber pads and a set of quick-snap brackets are included with each CPU cooler. In addition, an extra set of quick-snap brackets and anti-vibration rubber pads come standard to give users the option of enabling even greater cooling performance by installing another fan. The quick-snap brackets make changing, adding, and cleaning fans an easy task that requires only a few seconds. Dynamically control the included PWM fan via BIOS or OS-based motherboard tuning applications. There is no need to choose between overclocking performance and stock stability, the Hyper 212 & TX3 EVO are a versatile pair that tailor noise and performance to any need.
Find the new legend, the Hyper 212 & TX3 EVO, at online and retail locations that sell your favorite Cooler Master, CM Storm, and Choiix products. They will be available in October 2011.
