AMDs future Interlagos processors will feature as much as 20 computing cores and support for the PCI Express 3.0 standard. And we're talking about 2012 here already.

According to a roadmap uncovered by CPU-World, AMD's 2012 server chip offering users the Sepang and Terramar code names, and both of these are built using the 32nm fabrication process.

The Sepang core will be employed in the Opteron 4000-series processors and will feature up to ten computing cores, PCI Express 3.0 support, as well as an integrated tri-channel memory controller. These will be compatible with the C2012 socket motherboards based on the Luxembourg platform.

Its more powerful brothers based on the Terramar design will be actually built by packing together two Sepang dies delivering a maximum of 20 processing cores also with PCI Express 3.0 support and a quad-channel memory interface.

The chips will work in one to four-way G2012 socket motherboard that are built on the Porto platform.

AMD plans to use the same platform also for its 2013 Opteron 6000-series server processors that will be known by the code name of Dublin.

Information about this chips is scarce at this point in time, but the slide does reveal that they will be built using the 28nm fabrication process and will pack up to 20 cores, just as Terramar.

On the Opteron 4000-series front things will follow a similar path, as the new chips will also use the Luxembourg platform as the Sepang processors and will include up to 10 processing cores. No other details about the 2013 Opteron processors are available at this point in time.

Click on the thumbnail to watch the roadmap.