AMD reveals that its Ryzen 7000 series will support both the PCIe Gen5 standard and DDR5 memory technology. The LGA1718 socket will continue to be compatible with AM4 cooling.
In addition, the rumor of high-power TDP SKUs has been substantiated. The next-generation AM5 socket will support up to 170W, but this is not specified for the Ryzen 7000. AMD's next-generation mainstream desktop processors have no known SKUs, however they will be introduced alongside the X670E, X670, and B650 motherboards.
According to the business, the new processors support PCI Express 5.0 as well as DDR5 memory. The lga1718 socket will continue to work with existing AM4 coolers. It is also claimed that high-power CPUs will be available. Socket AM5 can accommodate CPUs with tdps of up to 170 watts. It is unclear whether this applies to Ryzen 7000 processors.
AMD claims that single-thread performance will be up to 15% greater. The CPUs have double the L2 cache on board, with 1 MB. The highest boost frequency is greater than 5 GHz. The chip is made up of two 5nm Zen4 chiplets (holding 8 cores each) and one 6nm I/O. A third CCD is not possible. The Zen4 desktop CPUs include a rdna2-GPU. In terms of performance, AMD claims that its Zen4 core architecture will provide over 15% single-thread uplift, 2X larger (1MB) L2 cache per core, and Max Boost speeds of over 5.5 GHz.
In a Blender demo AMD demonstrated a Intel Core i9-12900K and new Ryzen 7000 with 16 cores, with 204 seconds processing time for AMD is a thrid faster compared to the 297 seconds for Intels in the presented render test. This is one of the strengths of all AMD CPUs. That shouldn't come as a surprise; for instance, a Core i9-12900 performance K's in Blender is already 12 to 15 percent lower than that of a Ryzen 9 5950X. However, the percentage advantage appears to be more obvious here than in single-core settings; in the end, more than 31 percent is to AMD's credit for having superior performance.
This value is not as high as was projected in many places in advance, especially when taking into account the previous progress that was made on the same TDP level. This is because the power consumption has increased.
AMD has shown what is disguised beneath the new heatspreader. Two 5 nm Zen4 core chiplets and one 6nm I/O are included. There is certainly no room for a third CCD, but it is impossible to predict how this design will evolve in future generations. AMD also reveals that their Zen4 desktop CPU will include RDNA2 graphics.
RDNA2
AMD has publicly confirmed for the first time that an RDNA 2 iGPU is included in the desktop for Ryzen 7000. It can output images via up to four HDMI 2.1 and DisplayPort 2 outputs, and it decodes AV1 in hardware.
The new desktop Ryzen 7000 series is expected to ship 'this fall,' no specific date has been announced.
