Introduction
The ZenBook S 16 is one of the first laptops to incorporate AMD’s Ryzen AI processor, specifically the Ryzen 9 HX 370. This inclusion marks a change in how laptops handle demanding tasks, enabling enhanced performance across various applications, and in this case, what I like to call the Ai hype train. The model tested includes 32 GB of memory, a 1 TB SSD, and a built-in AMD Radeon 890M GPU. The ZenBook S 16 is its 2880×1800 (3K) OLED touchscreen display with a 120 Hz refresh rate. The OLED display provides deeper contrast, vibrant colors, and sharper visuals, making it nice choice for creative professionals or users who prioritize display quality. The 16-inch screen also offers a heaps of workspace without compromising on portability. But it's what's on the inside that matters. The start of this show is the Ryzen AI 9 HX 370 chip, a powerful advancement in AMD's ongoing rivalry within the chip industry. The AMD Ryzen AI 300 series will include three primary models: Ryzen AI 9 HX 375, Ryzen AI 9 HX 370, and Ryzen AI 9 365.
| Zen 5/Strix Point) | |||||||
| Cores | Base Freq | Turbo Frequency | L3 Cache | Graphics | NPU | TDP | |
| Ryzen AI 9 HX 375 | 4 x Zen 5 8 x Zen 5c | 2.0GHz | Zen 5: 5.1GHz Zen 5c: 3.3GHz | 24 MB | Radeon 890M 16 CU | XDNA 2 (55 TOPS) | 15-54W |
| Ryzen AI 9 HX 370 | 4x Zen 5 8x Zen5c | 2.0GHz | Zen 5: 5.1GHz Zen 5c: 3.3GHz | 24 MB | Radeon 890M 16 CU | XDNA 2 (50 TOPS) | 15-54W |
| Ryzen AI 9 365 | 4x Zen 5 6x Zen5c | 2.0GHz | Zen 5: 5.0GHz Zen 5c: 3.3 GHz | 24 MB | Radeon 880M 12 CU | XDNA 2 (50 TOPS) | 15-54W |
The flagship model, Ryzen AI 9 HX 375, features 12 CPU cores, while the Ryzen AI 9 HX 370 and Ryzen AI 9 365 have 12 and 10 cores respectively. Each of these System on Chips (SoCs) integrates both standard Zen 5 cores and compact Zen 5c cores within the CPU cluster. They are also equipped with Radeon 890M/880M GPUs and an XDNA 2-based Neural Processing Unit (NPU) for enhanced AI processing. The AMD Ryzen AI 9 HX 370 has a wide configurable TDP (Thermal Design Power) range from 15 to 54 watts. This flexibility allows the Strix Point chip to be used in a variety of devices, from ultrabooks to larger gaming laptops. However, the chip's performance, especially in tasks that require both the CPU and GPU, depends heavily on its TDP setting.
This review focuses on the ASUS Zenbook S 16 (2024), a 16-inch laptop powered by the AMD Ryzen AI 9 HX 370 processor. The Ryzen AI 9 HX 370 includes 4 Zen 5 cores and 8 Zen 5c cores, complemented by AMD's RDNA 3.5 Radeon 890M integrated graphics. The Ryzen AI 9 HX 370 processor supports a configurable Thermal Design Power (TDP) range from 15 to 54 watts, depending on the notebook's configuration, allowing for optimization between performance and power efficiency. Despite its 16-inch size, the ASUS Zenbook S 16 is set up quite conservatively. Originally designed for 28 watts, ASUS has reduced it to 17 watts for the initial setup, which they call "Standard Mode." This mode makes the laptop very efficient and quiet, though it does sacrifice some performance to keep noise levels down. For everyday computing tasks like handling multiple browser tabs, document editing, and streaming, the new Ryzen chip performs faster and more efficiently, as expected from an updated processor. Its improved capabilities are particularly beneficial for creators, aiding in tasks such as photo and video editing, gaming, and using professional-grade applications. This latest laptop is marked as AI-enabled, thanks to a Neural Processing Unit (NPU) that supports the execution of on-device large language models and generative AI applications.
Currently, AI features are somewhat limited. On the ZenBook S 16, two applications, Asus’ StoryCube and Amuse, an AI-driven image generator, illustrate the AI integration but do not fully demonstrate the AI's broader potential. ZenBook S 16 has the specs and now is Copilot Plus PC compatible.
AMD Ryzen AI 300 Series Mobile Processors (Zen 5/Strix Point)
The AMD Ryzen AI 300 series and Ryzen 9000 processors use AMD's latest Zen 5 microarchitecture, which improves on the previous Zen 4. These processors are made using TSMC's 4 nm N4P process, enhancing both performance and efficiency. The Strix Point SoCs feature a mix of large Zen 5 cores and smaller Zen 5c cores in a dual-core complex (CCX) setup. One CCX includes four full Zen 5 cores, and the other has eight smaller Zen 5c cores. The Zen 5c cores are 25% smaller than the Zen 5 cores and have different levels of L3 cache. The Zen 5 design aims to provide better Instructions Per Clock (IPC) than Zen 4, achieving a ~15% performance boost. Zen 5 emphasizes both high performance and power efficiency, making it suitable for mobile devices and servers. The Zen 5c cores nearly match the IPC of the full Zen 5 cores but are more compact, maintaining efficiency without losing processing power. However, the Zen 5 cores differ in mobile and desktop chips. Mobile Zen 5 cores do not have the 512-bit SIMD capability found in desktops and instead use a 256-bit SIMD, reflecting a focus on a balance between performance and power efficiency in mobile devices. The integrated graphics in AMD's Strix Point chips have been upgraded to the latest RDNA 3.5 architecture. While RDNA 3.5 doesn't introduce new features over RDNA 3, it enhances energy efficiency, which is vital for mobile devices. The updates allow for higher sustained clock speeds by reducing power use through improved memory management and other tweaks. Notably, RDNA 3.5 marks the first time an AMD SoC has a unique GPU architecture rather than a scaled-down version of its discrete GPU architecture. This approach allows AMD to optimize performance for mobile devices and could shape future designs.
