Product Teardown

Teardown

It is a request that is getting more and more daunting as we do not want to damage products. But user request on this is clear, you like a teardown and want to look to see what is going on at the PCB level. Opening up that trunk reveals a massive cooler. Nice to see are thermal padding everywhere and additional heatsinks in place at crucial segments. This also makes the card more sturdy, preventing it from bending. The backplate also reveals loads of thermal pads, helping cool down critical elements a bit. You'll notice that at that backside, for example, the GPU and GDDR6 IC locations are padded as well as part of the VRM. A quick count indicates 8 GPU phases. The GDDR6 chips are hard to read out (washed) but register back as made by Samsung, K4ZAF325BM-HC16, qualified and validated to run 16 Gbps. We had to do the teardown photos last minute so I need to do a further detailed analysis of the component overview, to be updated. One last remark, you can see two empty SMT traces for GDDR6, and also, the OPCB is much shorter than the actual cooler.