Intel Unveils Details of Granite Rapids-D Xeon 6 SoC, Targeting H1 2025 Release

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Interesting how they've ditched the word "tile" for "chiplet". I wonder what they used instead of glue.
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schmidtbag:

Interesting how they've ditched the word "tile" for "chiplet". I wonder what they used instead of glue.
"Packaging"? 😀
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schmidtbag:

Interesting how they've ditched the word "tile" for "chiplet". I wonder what they used instead of glue.
They sure used a lot of glue it seems !